RPG Student List


Jiayu TANG

Master Candidate in Chemical and Biomolecular Engineering

Supervisor: Prof. Ka Ming NG


Research Topic

Copper Thick Film Paste Formulation Development


Copper conductive paste is a promising material in electronic device market than silver or noble metal paste for its high conductivity and solderability as well as low electromigration and cost. However, the harsh sintering conditions such as high temperature and inert atmosphere limit the application of copper paste from further commercialization. In this project, a copper thick film paste will be developed via utilizing proposed bimodal size distribution of copper as metal filler to reduce the sintering temperature. Meanwhile, related modification on glass frits and substrates of the thick film will also be studied.

Journal Publication

Fu, Fang; Tang, Jiayu; Yao, Yuze; Shao, Minhua, "Hollow Porous Hierarchical-Structured 0.5Li2MnO3ยท0.5LiMn0.4Co0.3Ni0.3O2 as a High-Performance Cathode Material for Lithium-Ion Batteries", (2016)